Tungsten copper electronic packaging materials: both tungsten low expansion characteristics, but also has high thermal conductivity properties of copper, the thermal expansion coefficient and thermal conductivity of the composition can be varied by adjusting the material, giving the use of materials facilitated.
Tungsten copper alloy is an alloy of tungsten and copper. Commonly used copper content of the alloy is 10% to 50%. Preparation of alloy powder metallurgy method has good electrical and thermal conductivity, good high temperature strength and a certain plasticity. At very high temperatures, such as above 3000 ℃, the alloy of copper is liquefied and evaporated to absorb a lot of heat, reducing the surface temperature. So this kind of material is also referred to as metal sweat material.
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