Copper tungsten alloy tungsten copper composites

copper tungsten machining alloy tungsten copper composites: deflection tester to measure the shaft and sleeve-type parts of the disc runout, with a pair of Mohs hardness 4 # top, the progress of the new deflection tester's measurement accuracy, increasing Part of the measured radial support weight, high-precision measurement of parts, face and oblique runout. Yaw check the meter frame compact design fair, from top to bottom, front, left freely adjust smooth, convenient manipulation, table frame rigidity, improve the detection equipment agility. General deflection tester should fit a small cast iron platform.
Resin sand stiffness, high initial strength which pouring sand conditional use graphite cast iron solidification process of expansion, effectively eliminate shrinkage, shrinkage defects, to achieve gray iron, ductile iron and less riser, non-riser casting. And other large machine bed casting mold has a great advantage compared to traditional sand, it not only eliminates the need for expensive wood type costs, and ease of operation, shortening the production cycle, improve production efficiency importance of the development of tungsten-copper composite material
W-Ni-Cu alloy is mainly composed of W, Ni, Cu powder is mixed pressing sintering. Wherein, W content is generally 80% to 90% Ni and Cu binder was added after the two-phase alloy liquid phase sintering, a density close to the theoretical density. The alloy, in addition to W, Ni content is outside the residual copper content. Copper in the alloy can improve the strength and ductility of tungsten alloys. In terms of performance, the alloy special applications do not magnetic, and other physical properties of tungsten alloy having the same overall performance.
Machined Copper Tungsten Parts composite material made of high melting point, tungsten, high-density and high conductivity and low thermal expansion coefficient and high thermal conductivity of copper composition, combines both superior performance, such as having a high thermal conductivity, low coefficient of expansion, excellent high temperature strength and Anti-arc erosion properties. Back in the 1930s tungsten-copper composite material because of its good compressive strength and resistance to electrical ablation performance, high-voltage electrical switches and other industrial sectors has been widely used. Into the sixties, tungsten-copper composite material gradually gained in the field of welding electrode applications, aerospace components and other high temperature. Since then, with the gradual increase preparation technology, in the nineties as electronic packaging and heat sink material starts in the field of LSI and high-power electronic devices such as access to a wide range of applications. The twenty-first century, the tungsten-copper composite material is used as cover material HEAT medicine, materials and target missile nozzle caused concern in the military and high-tech fields.
Now, tungsten-copper composite material because of its good electrical conductivity, thermal conductivity and excellent thermal stability, has become a high-power microwave devices and ultra large scale integrated circuit substrate, slug, essential key material connections and cooling components, etc. its high thermal conductivity, high thermal stability and good near-net shape forming, can increase the use of power microelectronic devices, it is conducive to miniaturization of devices and sophisticated development. Low thermal expansion coefficient and the thermal expansion coefficient of tungsten-copper composite material adjustability, enabling semiconductor materials and microelectronics devices connected to its match in silicon, gallium arsenide and other useful ceramic materials, to avoid thermal fatigue damage caused by thermal stress broaden the tungsten-copper composite material in the field of microelectronics applications. Rate with high dimensional accuracy, small allowance, good surface quality and other advantages.